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We support high precision and a large number of fine groove processing through grinding.
【Work Size and Shape】 - Supports V shapes at any angle, as well as R shapes. 【Processing Accuracy】 - Pitch accuracy cumulative error of 0.3μm.
Small-diameter combined lathe, fine groove processing, shallow seat drilling processing, ultra-shallow recess processing, aluminum precision parts for semiconductor manufacturing equipment.
**Material** Material A5056 (a5056) **Industry and Application** Semiconductor manufacturing equipment industry Aluminum precision parts for semiconductor manufacturing equipment **Dimensions** φ10 × 11.5mm **Processing** Composite lathe Machining center **Features** This product is an aluminum precision part for industrial robots made from material A5056 (a5056). The product features a very shallow recessed area, as seen in the photo, with a tolerance of 0.05±0.003mm, which is extremely strict! Processing was performed using a composite lathe and a machining center. By machining the recessed area with a machining center, we can avoid the occurrence of protrusions in the center and achieve a beautiful surface finish! This product involves fine groove processing, but we also perform many other types of micro-processing, such as ultra-small diameter hole processing and mirror surface cutting! If you are having trouble with aluminum precision part processing, please contact Nakata Seisakusho! Additionally, our website provides detailed explanations of aluminum precision processing technology and aluminum precision parts, so please take a look.
Achieving fine groove processing of semiconductor devices with wire-cut electrical discharge machining!
In the semiconductor industry, as devices become more densely packed, the precision and quality of fine groove processing are becoming increasingly important. In particular, the shape, dimensional accuracy, and surface roughness of fine grooves, which influence the performance of wafers and chips, have a significant impact on yield and product lifespan. There is a demand for technology that can process difficult shapes and ultra-fine grooves at equal intervals. Our wire-cut electrical discharge machining technology addresses these challenges and supports the manufacturing of high-quality semiconductor devices. 【Application Scenarios】 - Fine groove processing of semiconductor wafers - Electrode groove processing of IC chips - Fine structure processing of MEMS devices - Processing of other semiconductor components requiring fine grooves 【Benefits of Implementation】 - Improved device performance through high-precision fine groove processing - Increased yield - Extended product lifespan - Enhanced design flexibility
